Today, we will learn about substrate lamination processes. Lamination process refers to the shaping and curing of inner core and raw materials (Prepreg, Copper Foil) according to a stacked structure for the production of multilayer package substrates. Detailed process: Lamination Preprocessing (Chemical Treating) - Lay-up Materials - Hot Press - Thickness Measurement - Product Separation (PNL Se..

SiP Next, let's take a detailed look at the SiP approach. SiP implements systems that perform various functions by integrating multiple chips (ICs), passive components, and spirals (inductors) on a single substrate. It is used in RF modules for mobile phones and comes in variations like Flip-Chip SiP, Cored & Coreless. SiP is primarily employed in PA modules that amplify signals. A distinctive f..

In the previous session, we learned about various types of substrates. In this session, we will start by exploring substrate terminology and then delve into SiP (System in Package) substrates in detail. PKG (Package) PKG is a technology that electrically connects semiconductor chips (Die) to a substrate and protects circuits from external impact. It is categorized based on the number of chips an..

1. BGA (Ball Grid Array) A type of substrate where solder balls are used to mount on the surface. It connects the PCB and the main board (motherboard) using solder balls and the chip and PCB are connected using wire bonding. Depending on the material used, there are variations like PBGA (Plastic), CBGA (Ceramic), TBGA (Tape), and Metal (Lead Frame) PGB. 2. FCBGA (Flip Chip Ball Grid Array) FCBGA..

There are various types of substrates used in semiconductor manufacturing. Today, let's explore different types of substrates. 1. CSP (Chip Scale Package) CSP is utilized in mobile electronic devices. Its small size leads to improved design density, and it boasts a high I/O count per unit area. CSP achieves high density by stacking chips. The chip occupies over 80% of the total package area. 2. ..

2. Sectioning (Square Punching) Sectioning other than point sectioning involves a waxing-crescent-shaped mold, similar to a half-moon shape. The purpose of general sectioning is to observe a consistent thickness of plated layer. Substrates punched into squares are placed in molds with recesses. When analyzing a large number of substrates, it's common to place 3 to 4 substrates per recess. Howeve..