Continuing from our previous session, let's further explore the PCB drilling process. Drilling Process 1. Principles of Drilling Process The process of machining PTH (Plating Through Hole) for interlayer circuit connectivity in the stacked panels and NPTH (Non Plating Through Hole) for alignment marks and assembly of fixtures. CNC (Computer Numerical Control) Drilling involves the use of automat..

Drill Bit Overview The drill bit needs to sequentially machine holes in the stacked board, so it is composed of high-strength materials, mainly tungsten and cobalt. Drill Bit Ring The collar ring that supports the bit to be aligned with the appropriate length in the Drilling M/C and Spindle Chuck is referred to as the drill bit ring. This ring is color-coded for different diameters to allow easy..

Today, we will learn about the substrate drilling process. Drilling Process: This process involves machining PTH (Plating Through Hole) for interlayer circuit connection and NPTH (Non Plating Through Hole) for reference points and fixture assembly on the stacked panels. Purpose: Machining reference points for the product after lamination. Creating holes for interlayer electrical connections. Mac..

The key terms of the pressing process are as follows: Heating Rate: This refers to the speed at which heat is raised over a certain period. It is necessary for prepreg forming since heat is required for the process. 1st Step Heat: This is the point where actual prepreg forming occurs. The temperature at this point is determined using viscosity data. Appropriate pressure should be applied at this..

In the previous session, we explored the detailed processes of the substrate lamination procedure up to lay-up. In this session, let's delve into the subsequent detailed processes. Detailed Processes: Chemical Treating (Chemical Treating) - Lay-up Materials - Hot Press - Measuring Product Thickness - Product Separation (PNL Separation) Note: The PNL separation process is applicable only to the C..

Lay-up Materials: This is a preparatory process for creating a multilayer structured product by stacking preprocessed items and raw materials. The workflow involves entering the carrier plate, applying a lower cushion pad, laying up the product, applying an upper cushion pad, and securing the product and applying a top cover. We will also explore the raw materials included in the "product lay-up..