Overgrowth Phenomenon: Poor DFR Adhesion -> Review DFR process. Pre-treatment error -> Adjust pre-treatment conditions. If DFR adhesion is poor or pre-treatment is too strong, overgrowth (bulging) of DFR occurs, causing detachment of the plated area. Thick film layer -> Change current settings. If the film layer is too thick, overgrowth beyond the DFR boundary occurs. Poor adjustment of shieldin..

Major Components of Electroless Plating - Inorganic CuSO4*5H2O: Source of Cu ions, increases conductivity of the plating solution along with sulfuric acid. H2SO4: Improves electrical conductivity, enhances throwing power, and reduces plating thickness variations. Cl-: Assists in inhibiting plating reduction along with the carrier. Aids in the reduction reaction from Cu2+ to Cu+ along with the br..

Catalyst: Pd complexes are adsorbed onto the non-conductive areas of the hole walls (such as epoxy/glass and PI film sections). Maintains a stable liquid state (should have minimal bubble and impurity generation). Important for Pd ion adsorption on the hole interior to ensure uniform plating thickness and achieve coverage on epoxy and glass fiber sections. Reducer: Imparts reduction ability to t..

Today, we will learn about electroless plating and chemical plating. Before that, let's briefly recap the detailed processes of plating. Desmear: Removes smear generated during laser processing and cleans the hole. Chemical Plating: Applies a copper coating through a chemical reaction to the holes created for interlayer electrical connection. Electroplating: Grows the thin copper layer formed in..

Desmear Detailed Process: 0. Drill Process: Drilling is performed to connect layers. Smear occurs within the holes on the base copper. Sweller: Weakens the bond between smear and epoxy resin. Epoxy Etching: Etches the epoxy resin, removing smear from the epoxy resin. Neutralizing: Cleans the interface between layers to provide stability for electrical connections. Swelling: Uses high-temperature..

Today, we will learn about the substrate drilling process. Drilling Process: This process involves machining PTH (Plating Through Hole) for interlayer circuit connection and NPTH (Non Plating Through Hole) for reference points and fixture assembly on the stacked panels. Purpose: Machining reference points for the product after lamination. Creating holes for interlayer electrical connections. Mac..