Uneven Plating Film: Poor conductivity -> Device repair. Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement. Weak agitation or blocked nozzles and filters can cause uneven plating film. High current density -> Reduce current density. High copper concentration -> Partial descaling / Dummy plating. Low sulfuric acid concentration -> Add refined sulfuric acid. Less a..

Burning Phenomenon: Poor conductivity -> Device repair. Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement. Poor adjustment of shielding plate -> Device repair. Low bath temperature -> Device repair. High current density -> Reduce current density. Low additive concentration -> Add additives. High additive concentration -> Dummy plating / Activated carbon filter tr..

Overgrowth Phenomenon: Poor DFR Adhesion -> Review DFR process. Pre-treatment error -> Adjust pre-treatment conditions. If DFR adhesion is poor or pre-treatment is too strong, overgrowth (bulging) of DFR occurs, causing detachment of the plated area. Thick film layer -> Change current settings. If the film layer is too thick, overgrowth beyond the DFR boundary occurs. Poor adjustment of shieldin..

Overfill Defect: High copper concentration -> Dummy plating / Partial descaling. Low sulfuric acid concentration -> Add purified sulfuric acid. High current density -> Reduce current density. Low Brightener concentration -> Increase Brightener concentration. Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement. Weak or blocked nozzle and filter inlet weaken agitatio..

Void Defect: Weak agitation -> Review spray pump settings / Nozzle cleaning / Filter replacement. Weak agitation accelerates detachment near the hole's opening, making voids more likely to form. If the nozzle and filter inlet are blocked, agitation weakens, leading to void formation. High current density -> Reduce current density. High current density accelerates detachment near the hole's openi..

Continuing from the previous session, let's delve into troubleshooting electroless defects and their causes. Dimple Defect: Low copper concentration -> Add cuprous oxide or high-purity cupric sulfate. High sulfuric acid concentration -> Partial descaling. When the copper concentration is low or sulfuric acid concentration is high, deposition occurs in a hole-like manner due to increased polariza..