Overgrowth Phenomenon: Poor DFR Adhesion -> Review DFR process. Pre-treatment error -> Adjust pre-treatment conditions. If DFR adhesion is poor or pre-treatment is too strong, overgrowth (bulging) of DFR occurs, causing detachment of the plated area. Thick film layer -> Change current settings. If the film layer is too thick, overgrowth beyond the DFR boundary occurs. Poor adjustment of shieldin..

Let's take a look at the defects in electroless plating. First, let's review the mechanism of electroless plating. Initially, due to the diffusion theory, deposition on the surface is inhibited, and the center of the through-hole (TH) connects. Next, according to the memory effect, deposition in the center of the TH is promoted, resulting in a smoother surface. Diffusion Theory: Due to strong ex..

Major Components of Electroless Plating - Inorganic CuSO4*5H2O: Source of Cu ions, increases conductivity of the plating solution along with sulfuric acid. H2SO4: Improves electrical conductivity, enhances throwing power, and reduces plating thickness variations. Cl-: Assists in inhibiting plating reduction along with the carrier. Aids in the reduction reaction from Cu2+ to Cu+ along with the br..

I will learn about the mechanism and additives of electroless copper plating. Electroless Copper Plating Mechanism: Applying a cathode to the product intended for plating, causing the deposition of Cu. Soluble anode vs Insoluble anode 비교 Soluble anode - reaction : Cu -> Cu2+ + 2e- - by product : need to management with lever less donate system - cost : cheap - current distribution : poor - anode..

Electroplating Equipment Structure: Loader - Degreasing - Rinse - Trevisash - Rinse - Sulfuric Acid Bath - Anode Copper Bath - Rinse - Trevisash - Rinse - Unloader Components include the cathode, bus bar (+), anode bus bar, insoluble anode (-), membrane filter, hanger (clamp), working panel, e-ductors, and panel guide. Electroplating Detailed Process Pretreatment - Electroplating Pretreatment: I..

Principle of Chemical Plating (However, the specific chemicals used, designs, and principles can vary depending on the chemicals used.) Utilizing the tendency of metals to ionize, Cu ions are reduced and deposited onto the product using Pd as a catalyst. Formaldehyde (HCHO) is oxidized to emit electrons on the Pd surface, supplying Cu+ ions to facilitate the deposition of Cu on the Pd surface. P..