Catalyst: Pd complexes are adsorbed onto the non-conductive areas of the hole walls (such as epoxy/glass and PI film sections). Maintains a stable liquid state (should have minimal bubble and impurity generation). Important for Pd ion adsorption on the hole interior to ensure uniform plating thickness and achieve coverage on epoxy and glass fiber sections. Reducer: Imparts reduction ability to t..

Last time, we learned about the purpose and principles of chemical plating, as well as the detailed process up to cleaner/conditioner. In this session, we will continue with the next step in the detailed process, which is soft-etching. Detailed Chemical Plating Process: cleaner/conditioner - soft etching - pre dip - catalyst - reducer - electroless copper Soft Etching: Removes oxide layers on th..

Principle of Chemical Plating (However, the specific chemicals used, designs, and principles can vary depending on the chemicals used.) Utilizing the tendency of metals to ionize, Cu ions are reduced and deposited onto the product using Pd as a catalyst. Formaldehyde (HCHO) is oxidized to emit electrons on the Pd surface, supplying Cu+ ions to facilitate the deposition of Cu on the Pd surface. P..

Today, we will learn about electroless plating and chemical plating. Before that, let's briefly recap the detailed processes of plating. Desmear: Removes smear generated during laser processing and cleans the hole. Chemical Plating: Applies a copper coating through a chemical reaction to the holes created for interlayer electrical connection. Electroplating: Grows the thin copper layer formed in..

Desmear Detailed Process: 0. Drill Process: Drilling is performed to connect layers. Smear occurs within the holes on the base copper. Sweller: Weakens the bond between smear and epoxy resin. Epoxy Etching: Etches the epoxy resin, removing smear from the epoxy resin. Neutralizing: Cleans the interface between layers to provide stability for electrical connections. Swelling: Uses high-temperature..

The substrate electroplating process consists of three stages: desmear, chemical electroplating, and electroplating. In this session, we will focus on the first stage, the desmear process. Desmear: The process of removing smear generated during laser processing to clean the holes. Smear is composed of polymer resin residues and carbides formed due to the heat generated during drilling (CNC or La..