Burning Phenomenon: Poor conductivity -> Device repair. Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement. Poor adjustment of shielding plate -> Device repair. Low bath temperature -> Device repair. High current density -> Reduce current density. Low additive concentration -> Add additives. High additive concentration -> Dummy plating / Activated carbon filter tr..

Void Defect: Weak agitation -> Review spray pump settings / Nozzle cleaning / Filter replacement. Weak agitation accelerates detachment near the hole's opening, making voids more likely to form. If the nozzle and filter inlet are blocked, agitation weakens, leading to void formation. High current density -> Reduce current density. High current density accelerates detachment near the hole's openi..

Defects and Causes Analysis (Troubleshooting): Nodule Dimple Void Overfill Pit and pinhole Bridging phenomenon Whisker growth Large arc rate Burning phenomenon Plating film cracking Non-uniform plating film Nodule Defect: Low additive concentration -> Increase additive concentration. High additive concentration -> Dummy plating / Activated carbon filter treatment. When the additive concentration..

Last time, we learned about the purpose and principles of chemical plating, as well as the detailed process up to cleaner/conditioner. In this session, we will continue with the next step in the detailed process, which is soft-etching. Detailed Chemical Plating Process: cleaner/conditioner - soft etching - pre dip - catalyst - reducer - electroless copper Soft Etching: Removes oxide layers on th..

Principle of Chemical Plating (However, the specific chemicals used, designs, and principles can vary depending on the chemicals used.) Utilizing the tendency of metals to ionize, Cu ions are reduced and deposited onto the product using Pd as a catalyst. Formaldehyde (HCHO) is oxidized to emit electrons on the Pd surface, supplying Cu+ ions to facilitate the deposition of Cu on the Pd surface. P..

Stripping: After electroplating, the photosensitive film DFR is removed using a dedicated stripping agent of Amin-based chemicals for fine circuit formation First, the dry film swells and strips Stripped dry film fragments cannot withstand internal pressure and break apart Residue on the bottom is removed through additional stripping spray process Improper stripping that leaves DFR behind can in..