SiP (System in Package)

SiP

Next, let's take a detailed look at the SiP approach. SiP implements systems that perform various functions by integrating multiple chips (ICs), passive components, and spirals (inductors) on a single substrate. It is used in RF modules for mobile phones and comes in variations like Flip-Chip SiP, Cored & Coreless.

 

SiP is primarily employed in PA modules that amplify signals. A distinctive feature is the enhanced heat dissipation capability achieved by thickening the plating (metal layer) in the area where chips are placed.

Cored products require the creation of a design pan-out area due to the PTH (Plated Through Hole) pitch in the cored large via. Coreless products allow all layers to be used as signal layers, increasing design flexibility. Designers can maximize the utilization of wiring areas for optimal efficiency. Additionally, thermal dissipation efficiency is greatly enhanced.

 

PTH (Plated Through Hole): Hole that goes completely through the middle, processed using mechanical drills

 

BVH (Blind Via Hole): Hole that does not go through the entire printed circuit board, can be processed using both mechanical and laser drills

 

IVH (Inner Via Hole): Hole that only goes through the CCL (Copper-Clad Laminate) layer, processed using laser drills

 

Today, we've explored various substrate terminologies and learned about SiP substrates as well.