Types of Substrates (CSP, FCCSP)

There are various types of substrates used in semiconductor manufacturing. Today, let's explore different types of substrates.

 

1. CSP (Chip Scale Package)

CSP is utilized in mobile electronic devices. Its small size leads to improved design density, and it boasts a high I/O count per unit area. CSP achieves high density by stacking chips. The chip occupies over 80% of the total package area.

 

2. FCCSP (Flip Chip - Chip Scale Package)

FCCSP is a CSP where chips and PCBs are connected using bumps instead of wire bonding. It finds applications in high-frequency scenarios. After connecting the chip and PCB with bumps, the area between them is filled with insulating material (underfill) for protection. Depending on the connection technique, it's categorized as Area array or Peripheral bump.