Substrates(39)
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Circuit process (3)
Stripping: After electroplating, the photosensitive film DFR is removed using a dedicated stripping agent of Amin-based chemicals for fine circuit formation First, the dry film swells and strips Stripped dry film fragments cannot withstand internal pressure and break apart Residue on the bottom is removed through additional stripping spray process Improper stripping that leaves DFR behind can in..
2023.10.30 -
Circuit process (2)
Next, let's learn about the main mechanisms for each circuit fabrication process. Major Mechanisms for Each Circuit Fabrication Process Front Side - DFR Adhesion (Lamination) - Photolithography - Stripping - Etching - AOI Front Side: Removal of foreign substances from the substrate surface before adhering the photosensitive film DFR (Rinse - Acid Rinse - Rinse) DFR Adhesion (Lamination): Adhesio..
2023.10.26 -
Circuit process (1)
Let's learn about the PCB circuit fabrication process. Types of Circuit Implementation Processes There are two types of circuit implementation processes: Tenting method and SAP method. Tenting Method: A process where unnecessary copper is etched away, leaving only the required copper for the desired circuit design to form. The detailed process is as follows: Via hole processing Non-electrolytic ..
2023.10.23 -
Drilling process (6)
CO2 Laser Process A processing step within the package substrate process for implementing via holes. The layer-to-layer connection via holes are formed by controlling the beam power of the laser equipment. CO2 Laser Equipment Setup CO2 Laser equipment is divided into an oscillator, optical path, and processing unit. Galvano Mirror Configuration Galvano consists of mirrors and F-theta lenses. Gal..
2023.10.19 -
Drilling process (5)
Today, we will learn about the types of defects in CNC drilling and the CO2 laser process for implementing via holes. Defect Types in Drill Process Drill Eccentricity Cause: Board flex abnormality / Run-out, equipment misalignment / Foreign particles on board surface Defect Effect: Inner-layer short / Outer-layer open / Reliability issues Odd Drill Cause: Drill calibration misalignment / Stackin..
2023.10.16 -
Drilling process (4)
Types of Drilling Processes Single Pass Drill: The conventional method of drilling holes in PCBs where a bit passes through the PCB once to create a hole. Step Drill: A method to minimize bit breakage, where initially about 1/2 or 1/3 of the PCB is drilled and then the remaining portion is drilled to create the hole. Mainly used for thicker products. Double Drill: A method to enhance bit durabil..
2023.10.12