2023. 10. 2. 00:05ㆍSubstrates
Today, we will learn about the substrate drilling process.
Drilling Process:
This process involves machining PTH (Plating Through Hole) for interlayer circuit connection and NPTH (Non Plating Through Hole) for reference points and fixture assembly on the stacked panels.
Purpose:
Machining reference points for the product after lamination.
Creating holes for interlayer electrical connections.
Machining holes for fixture assembly.
Detailed Process:
X-ray Guide Drill: Machining based on target reference points formed in the inner layer by X-ray projection/recognition.
Trimming: Cutting the product outline to the specified size.
Stacking: Securing auxiliary materials and a specified quantity of products for the drilling operation.
Drilling: Machining holes in the stacked products.
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