Stacking process (3)

In the previous session, we explored the detailed processes of the substrate lamination procedure up to lay-up.

 

In this session, let's delve into the subsequent detailed processes.

 

Detailed Processes:

Chemical Treating (Chemical Treating) - Lay-up Materials - Hot Press - Measuring Product Thickness - Product Separation (PNL Separation)

 

Note: The PNL separation process is applicable only to the Coreless Type.

 

Lamination Process (Hot Press Lamination):

This process involves shaping the stacked product into a multilayer structure using the heat and pressure of a pressing device. There are hot press and cold press methods, with cold press not applying pressure but solely cooling the product.

 

Measuring Product Thickness

 

Product Separation (PNL Separation):

PNL separation is applicable only to the coreless type. Equal boards are created on both sides based on the PNL.

 

Today, we have learned about the detailed processes of substrate lamination.