Drilling process (6)

CO2 Laser Process

A processing step within the package substrate process for implementing via holes. The layer-to-layer connection via holes are formed by controlling the beam power of the laser equipment.

 

CO2 Laser Equipment Setup

CO2 Laser equipment is divided into an oscillator, optical path, and processing unit.

 

Galvano Mirror Configuration

Galvano consists of mirrors and F-theta lenses. Galvano adjusts the laser beam reflected from the mirror to match the X and Y axis processing coordinates on the substrate.

 

Upload DNC file to the machine.

Check Laser Conditions (Power, Galvano).

Load Product on Panel (PNL).

Read the Alignment Mark.

Perform Laser Drilling.

Unload the Processed PNL.

Process All PNLs.

Flip Over All PNLs and Repeat the Process for the Bottom Side.

CO2 Laser Processing Methods

Two-sided Laser Drill

 

Drilling is done from above in a V-shape.

Drilling is done from below in a V-shape.

Overall, a finely holed hourglass shape is completed.

One-sided Laser Drill

 

A trapezoidal-shaped hole is created.

Window + CO2 Laser

 

Windows are opened both above and below.

Resin is processed using CO2 laser to expand Window.

CO2 Cu Direct Drill

 

Copper and resin are processed to create the shape of Window + CO2 laser processing in a single step.

Up until now, we've covered the types of defects in CNC drilling and the CO2 laser process.