2023. 10. 23. 00:03ㆍSubstrates
Let's learn about the PCB circuit fabrication process.
Types of Circuit Implementation Processes
There are two types of circuit implementation processes: Tenting method and SAP method.
Tenting Method: A process where unnecessary copper is etched away, leaving only the required copper for the desired circuit design to form.
The detailed process is as follows:
Via hole processing
Non-electrolytic + Electrolytic plating
Lamination: Adhesion of photosensitive film (DFR: Dry Film Registration)
Photo + Develop: Exposure according to the product circuit design, and removal (development) of unnecessary DFR
Etching: Removal of exposed copper using chemicals after removing DFR
Stripping: Removal of used DFR using chemicals
SAP (Semi Additive Process) Method: A process where copper is selectively grown according to the product circuit design to implement the circuit.
The detailed process is as follows:
Via hole processing
Non-electrolytic + Flash plating (electrolytic)
Lamination: Adhesion of photosensitive film (DFR: Dry Film Registration)
Photo + Develop
Pattern plating
Stripping
Flash-etching
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