2023. 11. 6. 00:05ㆍSubstrates
Desmear Detailed Process:
0. Drill Process: Drilling is performed to connect layers. Smear occurs within the holes on the base copper.
Sweller: Weakens the bond between smear and epoxy resin.
Epoxy Etching: Etches the epoxy resin, removing smear from the epoxy resin.
Neutralizing: Cleans the interface between layers to provide stability for electrical connections.
Swelling:
Uses high-temperature and high-alkaline chemicals to weaken the molecular bonds between smear and epoxy resin, converting polymer to monomer. Breaking intermolecular bonds reduces energy activation, making etching easier.
Epoxy Etching:
Utilizes permanganic acid to etch the epoxy resin, simultaneously removing the interface smear. Smear, softened by the sweller, is removed by NaMnO4. Typically controlled by time.
Main Reaction: Epoxy resin + NaMnO4 + OH- -> 2MnO2 + CO2 + H2O + NaOH
Neutralizing:
Removes byproducts converted to manganese dioxide after the reaction and performs pre-conditioning for effective chemical electroplating.
Main Reaction: MnO4-, MnO4(2-), MnO2 + Neutralizer -> Mn(2+) + H2O
Today, we have covered the first step in the electroplating process, the desmear process. In the next post, we will continue by discussing chemical electroplating and electroplating.
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