Plating process (16)

Overgrowth Phenomenon:

 

Poor DFR Adhesion -> Review DFR process.

 

Pre-treatment error -> Adjust pre-treatment conditions.

 

If DFR adhesion is poor or pre-treatment is too strong, overgrowth (bulging) of DFR occurs, causing detachment of the plated area.

Thick film layer -> Change current settings.

 

If the film layer is too thick, overgrowth beyond the DFR boundary occurs.

Poor adjustment of shielding plate -> Device repair.

 

In areas with weak shielding effects, the thickness of the plated film becomes excessive, leading to overgrowth.

Bump Formation (Protruding Area):

 

Pre-treatment error -> Adjust pre-treatment solution concentration, re-descale.

Substrate contamination -> Re-evaluate substrate manufacturing process.

Contaminated substrates can lead to decreased adhesion of chemical copper films and electroplated copper films.

Large Arc Rate:

 

High copper concentration -> Dummy plating / Partial descaling.

High current density -> Reduce current density.

High Brightener concentration -> Dummy plating / Activated carbon filter treatment.

High copper concentration, current density, and Brightener concentration can lead to an increase in pattern shape.