2023. 12. 14. 00:16ㆍSubstrates
Continuing from the previous session, let's delve into troubleshooting electroless defects and their causes.
Dimple Defect:
Low copper concentration -> Add cuprous oxide or high-purity cupric sulfate.
High sulfuric acid concentration -> Partial descaling.
When the copper concentration is low or sulfuric acid concentration is high, deposition occurs in a hole-like manner due to increased polarization resistance.
Low additive concentration -> Increase additive concentration.
High additive concentration -> Dummy plating / Activated carbon filter treatment.
When the additive concentration goes beyond the control range, the balance of additive action is disrupted.
Inadequate agitation -> Review spray pump settings / Nozzle cleaning / Filter replacement.
Excessive agitation leads to thin diffusion layers in the holes, resulting in dimple-like formations.
Impurities -> Dummy plating / Activated carbon filter treatment.
Impurities hinder the action of additives.
Extended idle time (+ high temperature during idle period) -> Dummy plating with chillers during idle state.
Prolonged high-temperature idle conditions can lead to degradation of additives.
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