Plating process (15)

Overfill Defect:

 

High copper concentration -> Dummy plating / Partial descaling.

 

Low sulfuric acid concentration -> Add purified sulfuric acid.

 

High current density -> Reduce current density.

 

Low Brightener concentration -> Increase Brightener concentration.

 

Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement.

 

Weak or blocked nozzle and filter inlet weaken agitation, leading to overfill.

Pit and Pin Hole Defect:

 

Pre-treatment error -> Adjust pre-treatment solution concentration, re-descale.

Substrate contamination -> Re-evaluate substrate manufacturing process.

Impurities -> Dummy plating / Activated carbon filter treatment.

Attachment of bubbles -> Stop air operation to prevent air entrapment and identify air generation causes.

Attachment of minute bubbles can cause pit formation.