Today, we will learn about substrate lamination processes. Lamination process refers to the shaping and curing of inner core and raw materials (Prepreg, Copper Foil) according to a stacked structure for the production of multilayer package substrates. Detailed process: Lamination Preprocessing (Chemical Treating) - Lay-up Materials - Hot Press - Thickness Measurement - Product Separation (PNL Se..

Substrate sectioning can be classified into three types based on the mold type, sectioning purpose, etc. Let's explore this and also look into p-lab as a side note. 1. Point Section A point section involves sectioning only up to a specific point. For example, it's often used to observe defects caused by foreign particles, such as bump defects or pinhole defects, on the substrate. The mold for a ..

4. The fully cured mold is now ready for sectioning. In simple terms, this involves using a grinder. There are four steps, from 1 to 4, with each step becoming progressively smoother. Step 1 is the roughest, so it's common to go up to step 1 just before reaching the desired height. For point sections, it's crucial to only section up to the exact point, so care must be taken not to remove the poi..

Through sectioning, you can observe a cross-section of the substrate. Today, we will delve into the process of sectioning. Process of Sectioning The process of sectioning is as follows: 1. Punch the substrate into small rectangles or squares. As explained later, for point sections, square punching is done, and you must be careful not to cut the point section during punching. 2. Insert the punche..

이번 게시물부터는 CMP 공정(Chemical-Mechanical Polishing)에 대하여 알아보겠습니다. CMP 공정 (Chemical Mechanical Polishing) : 웨이퍼 표면에 생성된 산화막, 금속막 등의 박막을 화학적 작용과 물리적 작용을 동시에 활용하여 평탄화하는 공정 1. CMP 설비 구성 1) 연마 패드 : 패드의 경도, 표면 거칠기 등 패드 특성이 CMP 공정 품질에 중요 2) 웨이퍼 캐리어 (연마 헤드) : 웨이퍼를 고정하고 압력을 가해 CMP 패드에 눌러줌과 동시에 웨이퍼를 일정 속도로 회전시킴 3) 슬러리 분사기 : 선택비 향상 등 CMP 특성을 개선할 수 있음 2. CMP 원리 1) 산화막 CMP 2) 금속 CMP 3. CMP 공정의 중요 파라미터 1) Removal..