Circuit process (3)

Stripping:

After electroplating, the photosensitive film DFR is removed using a dedicated stripping agent of Amin-based chemicals for fine circuit formation

 

First, the dry film swells and strips

Stripped dry film fragments cannot withstand internal pressure and break apart

Residue on the bottom is removed through additional stripping spray process

Improper stripping that leaves DFR behind can interfere with chemical treatment in the subsequent etching process, leading to short-circuit defects

Etching:

Copper is removed using sulfuric acid and peroxide-based chemicals to etch the base copper

 

Purpose and Principles of Additives:

 

Short-chain organic solvents containing hydroxy groups: Increase surface wettability, induce uniform etching of the surface

Inhibitors of the azole group: Inhibit etching in the lateral direction of the circuit, aiming to maximize circuit width

 

That concludes our exploration of the substrate circuit fabrication process.