Circuit process (2)

Next, let's learn about the main mechanisms for each circuit fabrication process.

 

Major Mechanisms for Each Circuit Fabrication Process

 

Front Side - DFR Adhesion (Lamination) - Photolithography - Stripping - Etching - AOI

 

Front Side:

Removal of foreign substances from the substrate surface before adhering the photosensitive film DFR (Rinse - Acid Rinse - Rinse)

 

DFR Adhesion (Lamination):

Adhesion of photosensitive film using a roller on the substrate that has undergone cleaning

 

Photolithography:

Exposing the photosensitive film to light according to the product design to cure it

 

Contact Exposure:

Relatively high resolution achievable

Good UV and energy transmission

Alignment is challenging

Mask damage can occur due to contact with the substrate and mask

Glass mask is necessary for fine pattern compatibility

 

LDI (Laser Direct Imaging):

No need for a mask

Photolithography process adjusted based on substrate flexibility

Difficult to manage, high cost, and maintenance expenses are substantial

Long tack time for photolithography

Limited availability of usable dry films

 

LDI Equipment Principle / Structure:

Design is converted to data and transmitted to multiple photolithography heads

Each head uses DMD components to selectively expose the required design in each area

DMD consists of an array of micro mirrors that individually control light exposure at desired positions