2023. 9. 21. 00:04ㆍSubstrates
Lay-up Materials:
This is a preparatory process for creating a multilayer structured product by stacking preprocessed items and raw materials.
The workflow involves entering the carrier plate, applying a lower cushion pad, laying up the product, applying an upper cushion pad, and securing the product and applying a top cover.
We will also explore the raw materials included in the "product lay-up" process, namely prepreg and copper foil.
Prepreg plays a role in bonding the inner core and outer layer (copper foil). It is composed of glass fabric + resin. Glass is structured as fabric with resin initially coated in a partially cured state on top. Glass characteristics impact the product's scale. During pressing, resin melts and acts as a bonding agent between the inner core and outer layer. Higher resin content results in thicker prepreg.
Copper foil serves as the outer layer, upon which plating is grown and outer layer circuit patterns are formed. It consists of thin copper + release copper. It has a matt side and a shiny side, and the pre-treated matt side is applied to the product.
The combination of copper foil and prepreg is referred to as CCL (Copper Clad Lamination).
'Substrates' 카테고리의 다른 글
Stacking process (4) (0) | 2023.09.28 |
---|---|
Stacking process (3) (0) | 2023.09.25 |
Stacking process (1) (0) | 2023.09.18 |
SiP (System in Package) (0) | 2023.09.14 |
Package, wire bonding, flip chip (0) | 2023.09.11 |