Stacking process (1)

Today, we will learn about substrate lamination processes.

 

Lamination process refers to the shaping and curing of inner core and raw materials (Prepreg, Copper Foil) according to a stacked structure for the production of multilayer package substrates.

 

Detailed process:

Lamination Preprocessing (Chemical Treating) - Lay-up Materials - Hot Press - Thickness Measurement - Product Separation (PNL Separation)

 

Note: The PNL separation process is only applicable to Coreless Type.

 

Lamination Preprocessing (Chemical Treating on Surface):

This process enhances adhesion by forming surface roughness to increase the surface area of the product.

 

The effectiveness of lamination preprocessing can be confirmed through factors such as etch rate, roughness, and peel strength. Etch rate (comparing weight difference before and after preprocessing) is checked since roughness is formed through etching. The even coating of organic layer on the product is also verified.