Types of Substrates (BGA, FCBGA, SiP)

1. BGA (Ball Grid Array)

A type of substrate where solder balls are used to mount on the surface. It connects the PCB and the main board (motherboard) using solder balls and the chip and PCB are connected using wire bonding. Depending on the material used, there are variations like PBGA (Plastic), CBGA (Ceramic), TBGA (Tape), and Metal (Lead Frame) PGB.

 

2. FCBGA (Flip Chip Ball Grid Array)

FCBGA is used for high-performance semiconductors demanding high I/O counts, such as CPUs, MPUs, and GPUs. It employs bump connections between the chip and PCB instead of wire bonding. The term "flip" indicates that the chip's terminals are flipped towards the PCB. It involves a Direct Chip Attach (DCA) method where the chip is directly attached to the PCB, enhancing speed.

 

3. SiP (System in Package)

This refers to a system where multiple chips and passive components are integrated onto a single substrate. It's used in RF modules for mobile devices, like mobile phones, wireless LANs, power amplifiers, filters, front-end modules, etc. With the increasing demand for miniaturization of electronic devices and advanced 5G infrastructure, the need for SiP has grown. Compared to existing substrate products, SiP offers customer value due to fewer development risks and various advantages. It integrates multiple ICs into a single package, reducing the number of required packages and providing good design flexibility and re-design flexibility. It allows plug-and-play insertion into one or various systems, and standard modularization for the same type of products.

 

Today, we've explored these various types of substrates.