Plating process (18)

Uneven Plating Film:

 

Poor conductivity -> Device repair.

 

Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement.

 

Weak agitation or blocked nozzles and filters can cause uneven plating film.

High current density -> Reduce current density.

 

High copper concentration -> Partial descaling / Dummy plating.

 

Low sulfuric acid concentration -> Add refined sulfuric acid.

 

Less adjustment of shielding plate -> Device repair.

 

In areas with weak shielding effects, the plated film becomes thicker unevenly.

Impurities -> Dummy plating / Activated carbon filter treatment.

 

We have covered various aspects of electroplating. This concludes the final part of the substrate plating process.