2023. 12. 28. 00:01ㆍSubstrates
Burning Phenomenon:
Poor conductivity -> Device repair.
Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement.
Poor adjustment of shielding plate -> Device repair.
Low bath temperature -> Device repair.
High current density -> Reduce current density.
Low additive concentration -> Add additives.
High additive concentration -> Dummy plating / Activated carbon filter treatment.
Plating Film Cracking:
Poor conductivity -> Device repair.
Poor conductivity inhibits normal film growth and can cause plating film cracking.
Defective hole processing -> Review substrate manufacturing process.
If large pressure and cracks occur during hole processing, it can lead to plating film cracking.
Impurities -> Dummy plating / Partial descaling / Activated carbon filter treatment.
Deterioration of film properties -> Dummy plating / Partial descaling / Activated carbon filter treatment.
Impurities mixed in the film can lead to deterioration of film properties and result in plating film cracking.
Thin film -> Change current settings.
Thin films may not withstand thermal stress, leading to easier occurrence of plating film cracking.
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