2023. 12. 11. 00:16ㆍSubstrates
Defects and Causes Analysis (Troubleshooting):
Nodule
Dimple
Void
Overfill
Pit and pinhole
Bridging phenomenon
Whisker growth
Large arc rate
Burning phenomenon
Plating film cracking
Non-uniform plating film
Nodule Defect:
Low additive concentration -> Increase additive concentration.
High additive concentration -> Dummy plating / Activated carbon filter treatment.
When the additive concentration goes beyond the control range, the balance of additive action is disrupted.
Impurities -> Dummy plating / Activated carbon filter treatment.
Impurities can lead to nodule formation.
Pre-treatment errors -> Adjust pre-treatment solution concentration and reconditioning.
Substrate contamination -> Review substrate manufacturing process.
A contaminated substrate can be a cause of nodule formation.
We have reviewed the mechanism and additives of electroless plating and explored the nodule defect. Next, we will continue explaining the dimple defect in the 13rd part of the electroless plating series.
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