Continuing from the previous session, let's delve into troubleshooting electroless defects and their causes. Dimple Defect: Low copper concentration -> Add cuprous oxide or high-purity cupric sulfate. High sulfuric acid concentration -> Partial descaling. When the copper concentration is low or sulfuric acid concentration is high, deposition occurs in a hole-like manner due to increased polariza..

Defects and Causes Analysis (Troubleshooting): Nodule Dimple Void Overfill Pit and pinhole Bridging phenomenon Whisker growth Large arc rate Burning phenomenon Plating film cracking Non-uniform plating film Nodule Defect: Low additive concentration -> Increase additive concentration. High additive concentration -> Dummy plating / Activated carbon filter treatment. When the additive concentration..