pcb(18)
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Circuit process (2)
Next, let's learn about the main mechanisms for each circuit fabrication process. Major Mechanisms for Each Circuit Fabrication Process Front Side - DFR Adhesion (Lamination) - Photolithography - Stripping - Etching - AOI Front Side: Removal of foreign substances from the substrate surface before adhering the photosensitive film DFR (Rinse - Acid Rinse - Rinse) DFR Adhesion (Lamination): Adhesio..
2023.10.26 -
Drilling process (4)
Types of Drilling Processes Single Pass Drill: The conventional method of drilling holes in PCBs where a bit passes through the PCB once to create a hole. Step Drill: A method to minimize bit breakage, where initially about 1/2 or 1/3 of the PCB is drilled and then the remaining portion is drilled to create the hole. Mainly used for thicker products. Double Drill: A method to enhance bit durabil..
2023.10.12 -
Drilling process (3)
Continuing from our previous session, let's further explore the PCB drilling process. Drilling Process 1. Principles of Drilling Process The process of machining PTH (Plating Through Hole) for interlayer circuit connectivity in the stacked panels and NPTH (Non Plating Through Hole) for alignment marks and assembly of fixtures. CNC (Computer Numerical Control) Drilling involves the use of automat..
2023.10.09 -
Stacking process (4)
The key terms of the pressing process are as follows: Heating Rate: This refers to the speed at which heat is raised over a certain period. It is necessary for prepreg forming since heat is required for the process. 1st Step Heat: This is the point where actual prepreg forming occurs. The temperature at this point is determined using viscosity data. Appropriate pressure should be applied at this..
2023.09.28 -
Types of Substrates (CSP, FCCSP)
There are various types of substrates used in semiconductor manufacturing. Today, let's explore different types of substrates. 1. CSP (Chip Scale Package) CSP is utilized in mobile electronic devices. Its small size leads to improved design density, and it boasts a high I/O count per unit area. CSP achieves high density by stacking chips. The chip occupies over 80% of the total package area. 2. ..
2023.09.04 -
Scanning Electron Microscope (SEM) (1)
Scanning Electron Microscope (SEM) is an electron microscope that uses an electron beam to obtain the surface of a specimen, and it has superior resolution compared to an optical microscope. Today, we will explore the usage of SEM, specifically focusing on the initial procedures. Process before inserting into SEM machine: I take SEM images of molded circuit boards. Since the molding itself is an..
2023.07.05