Burning Phenomenon: Poor conductivity -> Device repair. Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement. Poor adjustment of shielding plate -> Device repair. Low bath temperature -> Device repair. High current density -> Reduce current density. Low additive concentration -> Add additives. High additive concentration -> Dummy plating / Activated carbon filter tr..

I will learn about the mechanism and additives of electroless copper plating. Electroless Copper Plating Mechanism: Applying a cathode to the product intended for plating, causing the deposition of Cu. Soluble anode vs Insoluble anode 비교 Soluble anode - reaction : Cu -> Cu2+ + 2e- - by product : need to management with lever less donate system - cost : cheap - current distribution : poor - anode..

Next, let's learn about the main mechanisms for each circuit fabrication process. Major Mechanisms for Each Circuit Fabrication Process Front Side - DFR Adhesion (Lamination) - Photolithography - Stripping - Etching - AOI Front Side: Removal of foreign substances from the substrate surface before adhering the photosensitive film DFR (Rinse - Acid Rinse - Rinse) DFR Adhesion (Lamination): Adhesio..

Let's learn about the PCB circuit fabrication process. Types of Circuit Implementation Processes There are two types of circuit implementation processes: Tenting method and SAP method. Tenting Method: A process where unnecessary copper is etched away, leaving only the required copper for the desired circuit design to form. The detailed process is as follows: Via hole processing Non-electrolytic ..