Plating process (9)

I will learn about the mechanism and additives of electroless copper plating.

 

Electroless Copper Plating Mechanism:

Applying a cathode to the product intended for plating, causing the deposition of Cu.

 

Soluble anode vs Insoluble anode 비교

 

 

 

Soluble anode

 

- reaction : Cu -> Cu2+ + 2e-

 

- by product : need to management with lever less donate system

 

- cost : cheap

 

- current distribution : poor

 

- anode film issue : sensitive

 

 

 

Insoluble anode

 

- reaction : 2H2O -> O2 + 4H+ 2e-

 

- by product : less care for active by product

 

cost : expensive

 

current distribution : good

 

anode film issue : no