Defects and Causes Analysis (Troubleshooting): Nodule Dimple Void Overfill Pit and pinhole Bridging phenomenon Whisker growth Large arc rate Burning phenomenon Plating film cracking Non-uniform plating film Nodule Defect: Low additive concentration -> Increase additive concentration. High additive concentration -> Dummy plating / Activated carbon filter treatment. When the additive concentration..

Let's take a look at the defects in electroless plating. First, let's review the mechanism of electroless plating. Initially, due to the diffusion theory, deposition on the surface is inhibited, and the center of the through-hole (TH) connects. Next, according to the memory effect, deposition in the center of the TH is promoted, resulting in a smoother surface. Diffusion Theory: Due to strong ex..

Major Components of Electroless Plating - Inorganic CuSO4*5H2O: Source of Cu ions, increases conductivity of the plating solution along with sulfuric acid. H2SO4: Improves electrical conductivity, enhances throwing power, and reduces plating thickness variations. Cl-: Assists in inhibiting plating reduction along with the carrier. Aids in the reduction reaction from Cu2+ to Cu+ along with the br..

I will learn about the mechanism and additives of electroless copper plating. Electroless Copper Plating Mechanism: Applying a cathode to the product intended for plating, causing the deposition of Cu. Soluble anode vs Insoluble anode 비교 Soluble anode - reaction : Cu -> Cu2+ + 2e- - by product : need to management with lever less donate system - cost : cheap - current distribution : poor - anode..

Electroplating Equipment Structure: Loader - Degreasing - Rinse - Trevisash - Rinse - Sulfuric Acid Bath - Anode Copper Bath - Rinse - Trevisash - Rinse - Unloader Components include the cathode, bus bar (+), anode bus bar, insoluble anode (-), membrane filter, hanger (clamp), working panel, e-ductors, and panel guide. Electroplating Detailed Process Pretreatment - Electroplating Pretreatment: I..

Today, we will delve into the electroplating process as part of the substrate plating stages. Electroplating involves using electro-deposition to grow a thin copper (Cu) layer on top of the chemically deposited layer. This process enhances reliability. Electroplating Process Overview: It involves introducing a plating solution containing Cu ions and supplying electrons to the plating solution to..