Types of Cross Section (2)

2. Sectioning (Square Punching)

 

Sectioning other than point sectioning involves a waxing-crescent-shaped mold, similar to a half-moon shape.

 

The purpose of general sectioning is to observe a consistent thickness of plated layer.

 

Substrates punched into squares are placed in molds with recesses. When analyzing a large number of substrates, it's common to place 3 to 4 substrates per recess. However, if multiple substrates are placed, it's important to prevent air bubbles between them and to adjust the molding compound to a slightly more diluted consistency.

 

Unlike point sections, with general sectioning, even if the top surface is uneven, you should section from the bottom. This is because the substrate's tilt is significant. By using the horizontal reference of the base, sectioning from the bottom ensures an even cross-section that is not tilted.

 

3. Sectioning (Rectangular Punching)

Rectangular punching molds are primarily used when analyzing a single substrate. In the case of this mold, it lacks recesses, making it difficult to provide consistent support for multiple substrates. Naturally, since even a single substrate cannot support itself, folded thick paper is inserted on both sides of the substrate to provide support. It's recommended to use two pieces of paper on each side that are similar in size and shape. This is done to position the substrate in the center. Similarly, pay attention to the tilt and proceed with sectioning.

 

4. p-lab

As an additional note, let's also explore p-lab. Unlike the vertical sectioning of substrates, p-lab involves horizontal sectioning. During p-lab, shapes resembling a nautilus shell, such as concentric circles, are formed. Each concentric circle represents L1, SR, L2, SR, and so on.

 

P-lab is conducted to accurately determine the thickness of plating.

 

In conclusion, we've covered the three types of substrate sectioning and discussed p-lab as well.