Overgrowth Phenomenon: Poor DFR Adhesion -> Review DFR process. Pre-treatment error -> Adjust pre-treatment conditions. If DFR adhesion is poor or pre-treatment is too strong, overgrowth (bulging) of DFR occurs, causing detachment of the plated area. Thick film layer -> Change current settings. If the film layer is too thick, overgrowth beyond the DFR boundary occurs. Poor adjustment of shieldin..

I will learn about the mechanism and additives of electroless copper plating. Electroless Copper Plating Mechanism: Applying a cathode to the product intended for plating, causing the deposition of Cu. Soluble anode vs Insoluble anode 비교 Soluble anode - reaction : Cu -> Cu2+ + 2e- - by product : need to management with lever less donate system - cost : cheap - current distribution : poor - anode..

2. Sectioning (Square Punching) Sectioning other than point sectioning involves a waxing-crescent-shaped mold, similar to a half-moon shape. The purpose of general sectioning is to observe a consistent thickness of plated layer. Substrates punched into squares are placed in molds with recesses. When analyzing a large number of substrates, it's common to place 3 to 4 substrates per recess. Howeve..

Substrate sectioning can be classified into three types based on the mold type, sectioning purpose, etc. Let's explore this and also look into p-lab as a side note. 1. Point Section A point section involves sectioning only up to a specific point. For example, it's often used to observe defects caused by foreign particles, such as bump defects or pinhole defects, on the substrate. The mold for a ..

4. The fully cured mold is now ready for sectioning. In simple terms, this involves using a grinder. There are four steps, from 1 to 4, with each step becoming progressively smoother. Step 1 is the roughest, so it's common to go up to step 1 just before reaching the desired height. For point sections, it's crucial to only section up to the exact point, so care must be taken not to remove the poi..

Through sectioning, you can observe a cross-section of the substrate. Today, we will delve into the process of sectioning. Process of Sectioning The process of sectioning is as follows: 1. Punch the substrate into small rectangles or squares. As explained later, for point sections, square punching is done, and you must be careful not to cut the point section during punching. 2. Insert the punche..