reaction(4)
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Plating process (11)
Let's take a look at the defects in electroless plating. First, let's review the mechanism of electroless plating. Initially, due to the diffusion theory, deposition on the surface is inhibited, and the center of the through-hole (TH) connects. Next, according to the memory effect, deposition in the center of the TH is promoted, resulting in a smoother surface. Diffusion Theory: Due to strong ex..
2023.12.07 -
Plating process (9)
I will learn about the mechanism and additives of electroless copper plating. Electroless Copper Plating Mechanism: Applying a cathode to the product intended for plating, causing the deposition of Cu. Soluble anode vs Insoluble anode 비교 Soluble anode - reaction : Cu -> Cu2+ + 2e- - by product : need to management with lever less donate system - cost : cheap - current distribution : poor - anode..
2023.11.30 -
Plating process (7)
Today, we will delve into the electroplating process as part of the substrate plating stages. Electroplating involves using electro-deposition to grow a thin copper (Cu) layer on top of the chemically deposited layer. This process enhances reliability. Electroplating Process Overview: It involves introducing a plating solution containing Cu ions and supplying electrons to the plating solution to..
2023.11.23 -
Plating process (2)
Desmear Detailed Process: 0. Drill Process: Drilling is performed to connect layers. Smear occurs within the holes on the base copper. Sweller: Weakens the bond between smear and epoxy resin. Epoxy Etching: Etches the epoxy resin, removing smear from the epoxy resin. Neutralizing: Cleans the interface between layers to provide stability for electrical connections. Swelling: Uses high-temperature..
2023.11.06