Today, we will learn about the substrate drilling process. Drilling Process: This process involves machining PTH (Plating Through Hole) for interlayer circuit connection and NPTH (Non Plating Through Hole) for reference points and fixture assembly on the stacked panels. Purpose: Machining reference points for the product after lamination. Creating holes for interlayer electrical connections. Mac..

The key terms of the pressing process are as follows: Heating Rate: This refers to the speed at which heat is raised over a certain period. It is necessary for prepreg forming since heat is required for the process. 1st Step Heat: This is the point where actual prepreg forming occurs. The temperature at this point is determined using viscosity data. Appropriate pressure should be applied at this..

In the previous session, we explored the detailed processes of the substrate lamination procedure up to lay-up. In this session, let's delve into the subsequent detailed processes. Detailed Processes: Chemical Treating (Chemical Treating) - Lay-up Materials - Hot Press - Measuring Product Thickness - Product Separation (PNL Separation) Note: The PNL separation process is applicable only to the C..