Let's learn about the PCB circuit fabrication process. Types of Circuit Implementation Processes There are two types of circuit implementation processes: Tenting method and SAP method. Tenting Method: A process where unnecessary copper is etched away, leaving only the required copper for the desired circuit design to form. The detailed process is as follows: Via hole processing Non-electrolytic ..

In the previous session, we explored the detailed processes of the substrate lamination procedure up to lay-up. In this session, let's delve into the subsequent detailed processes. Detailed Processes: Chemical Treating (Chemical Treating) - Lay-up Materials - Hot Press - Measuring Product Thickness - Product Separation (PNL Separation) Note: The PNL separation process is applicable only to the C..

Lay-up Materials: This is a preparatory process for creating a multilayer structured product by stacking preprocessed items and raw materials. The workflow involves entering the carrier plate, applying a lower cushion pad, laying up the product, applying an upper cushion pad, and securing the product and applying a top cover. We will also explore the raw materials included in the "product lay-up..

Today, we will learn about substrate lamination processes. Lamination process refers to the shaping and curing of inner core and raw materials (Prepreg, Copper Foil) according to a stacked structure for the production of multilayer package substrates. Detailed process: Lamination Preprocessing (Chemical Treating) - Lay-up Materials - Hot Press - Thickness Measurement - Product Separation (PNL Se..