Overfill Defect: High copper concentration -> Dummy plating / Partial descaling. Low sulfuric acid concentration -> Add purified sulfuric acid. High current density -> Reduce current density. Low Brightener concentration -> Increase Brightener concentration. Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement. Weak or blocked nozzle and filter inlet weaken agitatio..

Principle of Chemical Plating (However, the specific chemicals used, designs, and principles can vary depending on the chemicals used.) Utilizing the tendency of metals to ionize, Cu ions are reduced and deposited onto the product using Pd as a catalyst. Formaldehyde (HCHO) is oxidized to emit electrons on the Pd surface, supplying Cu+ ions to facilitate the deposition of Cu on the Pd surface. P..