Overfill Defect: High copper concentration -> Dummy plating / Partial descaling. Low sulfuric acid concentration -> Add purified sulfuric acid. High current density -> Reduce current density. Low Brightener concentration -> Increase Brightener concentration. Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement. Weak or blocked nozzle and filter inlet weaken agitatio..

Continuing from the previous session, let's delve into troubleshooting electroless defects and their causes. Dimple Defect: Low copper concentration -> Add cuprous oxide or high-purity cupric sulfate. High sulfuric acid concentration -> Partial descaling. When the copper concentration is low or sulfuric acid concentration is high, deposition occurs in a hole-like manner due to increased polariza..

Let's take a look at the defects in electroless plating. First, let's review the mechanism of electroless plating. Initially, due to the diffusion theory, deposition on the surface is inhibited, and the center of the through-hole (TH) connects. Next, according to the memory effect, deposition in the center of the TH is promoted, resulting in a smoother surface. Diffusion Theory: Due to strong ex..

Electroplating Equipment Structure: Loader - Degreasing - Rinse - Trevisash - Rinse - Sulfuric Acid Bath - Anode Copper Bath - Rinse - Trevisash - Rinse - Unloader Components include the cathode, bus bar (+), anode bus bar, insoluble anode (-), membrane filter, hanger (clamp), working panel, e-ductors, and panel guide. Electroplating Detailed Process Pretreatment - Electroplating Pretreatment: I..

Today, we will learn about the types of defects in CNC drilling and the CO2 laser process for implementing via holes. Defect Types in Drill Process Drill Eccentricity Cause: Board flex abnormality / Run-out, equipment misalignment / Foreign particles on board surface Defect Effect: Inner-layer short / Outer-layer open / Reliability issues Odd Drill Cause: Drill calibration misalignment / Stackin..