Defects and Causes Analysis (Troubleshooting): Nodule Dimple Void Overfill Pit and pinhole Bridging phenomenon Whisker growth Large arc rate Burning phenomenon Plating film cracking Non-uniform plating film Nodule Defect: Low additive concentration -> Increase additive concentration. High additive concentration -> Dummy plating / Activated carbon filter treatment. When the additive concentration..

Today, we will delve into the electroplating process as part of the substrate plating stages. Electroplating involves using electro-deposition to grow a thin copper (Cu) layer on top of the chemically deposited layer. This process enhances reliability. Electroplating Process Overview: It involves introducing a plating solution containing Cu ions and supplying electrons to the plating solution to..

Desmear Detailed Process: 0. Drill Process: Drilling is performed to connect layers. Smear occurs within the holes on the base copper. Sweller: Weakens the bond between smear and epoxy resin. Epoxy Etching: Etches the epoxy resin, removing smear from the epoxy resin. Neutralizing: Cleans the interface between layers to provide stability for electrical connections. Swelling: Uses high-temperature..

Lay-up Materials: This is a preparatory process for creating a multilayer structured product by stacking preprocessed items and raw materials. The workflow involves entering the carrier plate, applying a lower cushion pad, laying up the product, applying an upper cushion pad, and securing the product and applying a top cover. We will also explore the raw materials included in the "product lay-up..