In the previous session, we explored the detailed processes of the substrate lamination procedure up to lay-up. In this session, let's delve into the subsequent detailed processes. Detailed Processes: Chemical Treating (Chemical Treating) - Lay-up Materials - Hot Press - Measuring Product Thickness - Product Separation (PNL Separation) Note: The PNL separation process is applicable only to the C..

Today, we will learn about substrate lamination processes. Lamination process refers to the shaping and curing of inner core and raw materials (Prepreg, Copper Foil) according to a stacked structure for the production of multilayer package substrates. Detailed process: Lamination Preprocessing (Chemical Treating) - Lay-up Materials - Hot Press - Thickness Measurement - Product Separation (PNL Se..