Stripping: After electroplating, the photosensitive film DFR is removed using a dedicated stripping agent of Amin-based chemicals for fine circuit formation First, the dry film swells and strips Stripped dry film fragments cannot withstand internal pressure and break apart Residue on the bottom is removed through additional stripping spray process Improper stripping that leaves DFR behind can in..

Let's learn about the PCB circuit fabrication process. Types of Circuit Implementation Processes There are two types of circuit implementation processes: Tenting method and SAP method. Tenting Method: A process where unnecessary copper is etched away, leaving only the required copper for the desired circuit design to form. The detailed process is as follows: Via hole processing Non-electrolytic ..

지난 시간에는 화학 동도금의 목적과 원리, 세부 공정 중 cleaner/conditioner까지 알아보았습니다. 이번 시간에는 다음 세부 공정인 soft-etching부터 알아보겠습니다. 화학 동도금 세부 공정 cleaner/conditioner - soft etching - pre dip - catalyst - reducer - electroless copper soft-etching - 동박 표면의 산화막 제거 및 조도 형성, 밀착력 향상 - 동박 면 위의 conditioning agent 제거 - positive charge(+) 부여 - SPS type과 과수(H2SO4 / H2 O2) type이 있음 과수(H2SO4/H2 O2) type chemical mechanism Cu + H2O2 + 2..