Defects and Causes Analysis (Troubleshooting): Nodule Dimple Void Overfill Pit and pinhole Bridging phenomenon Whisker growth Large arc rate Burning phenomenon Plating film cracking Non-uniform plating film Nodule Defect: Low additive concentration -> Increase additive concentration. High additive concentration -> Dummy plating / Activated carbon filter treatment. When the additive concentration..

Principle of Chemical Plating (However, the specific chemicals used, designs, and principles can vary depending on the chemicals used.) Utilizing the tendency of metals to ionize, Cu ions are reduced and deposited onto the product using Pd as a catalyst. Formaldehyde (HCHO) is oxidized to emit electrons on the Pd surface, supplying Cu+ ions to facilitate the deposition of Cu on the Pd surface. P..

Today, we will learn about electroless plating and chemical plating. Before that, let's briefly recap the detailed processes of plating. Desmear: Removes smear generated during laser processing and cleans the hole. Chemical Plating: Applies a copper coating through a chemical reaction to the holes created for interlayer electrical connection. Electroplating: Grows the thin copper layer formed in..