Dimple(2)
-
Plating process (15)
Overfill Defect: High copper concentration -> Dummy plating / Partial descaling. Low sulfuric acid concentration -> Add purified sulfuric acid. High current density -> Reduce current density. Low Brightener concentration -> Increase Brightener concentration. Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement. Weak or blocked nozzle and filter inlet weaken agitatio..
2023.12.21 -
Plating process (13)
Continuing from the previous session, let's delve into troubleshooting electroless defects and their causes. Dimple Defect: Low copper concentration -> Add cuprous oxide or high-purity cupric sulfate. High sulfuric acid concentration -> Partial descaling. When the copper concentration is low or sulfuric acid concentration is high, deposition occurs in a hole-like manner due to increased polariza..
2023.12.14