CO2 Laser Process A processing step within the package substrate process for implementing via holes. The layer-to-layer connection via holes are formed by controlling the beam power of the laser equipment. CO2 Laser Equipment Setup CO2 Laser equipment is divided into an oscillator, optical path, and processing unit. Galvano Mirror Configuration Galvano consists of mirrors and F-theta lenses. Gal..

Today, we will learn about the types of defects in CNC drilling and the CO2 laser process for implementing via holes. Defect Types in Drill Process Drill Eccentricity Cause: Board flex abnormality / Run-out, equipment misalignment / Foreign particles on board surface Defect Effect: Inner-layer short / Outer-layer open / Reliability issues Odd Drill Cause: Drill calibration misalignment / Stackin..