Plating process (3)

Today, we will learn about electroless plating and chemical plating.

 

Before that, let's briefly recap the detailed processes of plating.

 

Desmear: Removes smear generated during laser processing and cleans the hole.

 

Chemical Plating: Applies a copper coating through a chemical reaction to the holes created for interlayer electrical connection.

 

Electroplating: Grows the thin copper layer formed in chemical plating through electroplating to enhance reliability.

 

Now, let's delve into the details of chemical plating.

 

Chemical Plating (Electroless Plating):

 

Deposition of copper ions through a chemical reduction of the reducing agent formalin on a palladium catalyst without using electricity.

Initially used to provide conductivity to non-conductive surfaces.

Plating process that deposits copper within holes formed by drilling to establish interlayer electrical connections.

Provides plating even in micro-sized areas that aren't covered by electroplating.