Plating process (7)

Today, we will delve into the electroplating process as part of the substrate plating stages.

 

Electroplating involves using electro-deposition to grow a thin copper (Cu) layer on top of the chemically deposited layer. This process enhances reliability.

 

Electroplating Process Overview:

It involves introducing a plating solution containing Cu ions and supplying electrons to the plating solution to deposit Cu. Through electroplating, the required thickness of the Cu layer is formed on the conductive layer created by chemical plating. This ensures the heat and electrical characteristics of the conductive circuit.

 

The formation of the metallic Cu layer secures the electrical functionality and reliability of the conductive circuit. Unlike chemical plating and electroless plating, electroplating is a process of electrolytic deposition.

 

Key Point: The amount of Cu deposition is proportional to the applied current and plating duration.

 

Adjacent Process Steps for Electroplating (Chemical Plating, Circuit Process):

 

Chemical Plating (Depositing Cu+ onto Pd by electron emission)

Circuit Process

Pretreatment (Cleaning by degreasing/etching)

Electroplating (Applying current through a rectifier to emit electrons and deposit Cu+)

 

Anode Reaction: 2H2O -> O2 + 4H+ + 4e- (2H+ is reduced, generating H2 gas)

Cathode Reaction: Cu2+ + 2e- -> Cu (O2- is oxidized, producing O2 gas)