Plating process (6)

Catalyst:

 

Pd complexes are adsorbed onto the non-conductive areas of the hole walls (such as epoxy/glass and PI film sections).

Maintains a stable liquid state (should have minimal bubble and impurity generation).

Important for Pd ion adsorption on the hole interior to ensure uniform plating thickness and achieve coverage on epoxy and glass fiber sections.

Reducer:

 

Imparts reduction ability to the ion-form Pd(2+) within the catalyst solution, thereby metallizing it.

Enhances the initial reaction rate of chemical plating.

Prevents influx of catalyst solution into the chemical plating solution.

Electroless Copper Plating:

 

Cu(2+) is reduced through a chemical oxidation/reduction reaction on the hole walls where Pd has been adsorbed, resulting in the deposition of metallic copper.

Creates conditions for electrical conductivity on epoxy/glass surfaces.

Up to this point, we have covered all the details of the chemical plating process.

 

In the next session, we will learn about the electroplating process.