I will learn about the mechanism and additives of electroless copper plating. Electroless Copper Plating Mechanism: Applying a cathode to the product intended for plating, causing the deposition of Cu. Soluble anode vs Insoluble anode 비교 Soluble anode - reaction : Cu -> Cu2+ + 2e- - by product : need to management with lever less donate system - cost : cheap - current distribution : poor - anode..

In the previous session, we learned about various types of substrates. In this session, we will start by exploring substrate terminology and then delve into SiP (System in Package) substrates in detail. PKG (Package) PKG is a technology that electrically connects semiconductor chips (Die) to a substrate and protects circuits from external impact. It is categorized based on the number of chips an..