Continuing from the previous session, let's delve into troubleshooting electroless defects and their causes. Dimple Defect: Low copper concentration -> Add cuprous oxide or high-purity cupric sulfate. High sulfuric acid concentration -> Partial descaling. When the copper concentration is low or sulfuric acid concentration is high, deposition occurs in a hole-like manner due to increased polariza..

The substrate electroplating process consists of three stages: desmear, chemical electroplating, and electroplating. In this session, we will focus on the first stage, the desmear process. Desmear: The process of removing smear generated during laser processing to clean the holes. Smear is composed of polymer resin residues and carbides formed due to the heat generated during drilling (CNC or La..